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    Customize Your Solution

    Cutting Edge. Custom Made.

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    Meeting the Challenges of Your Application

    Performance

    One of the main challenges for Cloud applications is maintaining high-performance and low latency, particularly when dealing with extreme volumes of data. MediaTek has expertise to design Cloud-grade ASIC solutions for data centers & servers using the latest Arm Neoverse CPUs, high performance on-chip/inter-chip interconnects, large embedded SRAM and diverse memory platform options, all to handle specific tasks or workloads, which can lead to improved performance and reduced latency, improving operational performance.

    Key Building Blocks:

    • Data Encryption / Decryption
    • Data Compression / Decompression
    • Multimedia Accelerators
    • Network Packet Processing
    • AI / ML
    • Chip to chip interconnect: SerDes 28G, 56G, 112G, 224G and beyond.
    • Die to die interconnect: UCIe-A, UCIe-S, Mlink, XSR/XSR+
    • Optical interconnect: Co-packaged Optics and AEC Driver/Cable
    • Other I/Os: PCIe Gen 5.0/6.0/7.0, USB, MIPI, UFS, etc…
    • Others interconnect: 800G/1.6T Retimer/GearBox/MacSec PHY, AEC Cable and Co-packaged Optics
    • Memory solutions: HBM4, Custom HBM4E, LPDDR5/5x, SRAM, TCAM, etc…
    • Ethernet, Global Cellular, Wi-Fi & Bluetooth Connectivity
    • Custom IP blocks
    Asics-chipset

    ASIC Cloud Solutions

    MediaTek's ASIC solutions are custom‑designed chips that cater to the unique requirements of cloud‑level applications. These chips are specifically designed for use in data centers, networking equipment, storage devices, and other cloud‑grade systems. MediaTek' is known for their high‑performance, power efficiency, and reliability, ASIC applications, making them ideal for demanding computing and networking environments. 

    These chips are designed to handle complex processing tasks, data‑intensive workloads, and advanced networking protocols, while also offering customization options to meet the specific needs of customers. With their advanced features and tailored designs, MediaTek's ASIC solutions provide a solid foundation for building reliable and efficient cloud‑grade systems.

    Advanced Packaging

    The choice of chip packaging is crucial to leading-edge chip design. MediaTek’s assured supply chain and partner ecosystem can accommodate monolithic silicon die designs with the ability to accommodate a single large area, and multi-chip module using various 2D, 2.5D or 3D layering on active or passive packages. Our extensive expertise allows us to meet a wide array of challenges in layout, yield, power consumption and thermal design at the initial feasibility and design stage, ensuring the optimal direction is selected from the very start.

    • Leading expertise in performance, power, thermal & cost factors
    • SoC, SiP, MCM chip design
    • 2D, 2.5D and 3D chip design (InFO-oS, CoWoS-S, CoWoS-L, EMIB, SOIC, etc…)
    • Active/passive packaging

    The Process

    Feasibility Study

    Feasibility Study

    Initial collaboration to enable a custom solution, considering performance, power, die size, cost, time to market, and scope of operations.

    Project launch

    Project Launch

    Assisting customers with platform design to be ready for wide scale integration into their portfolio.

    Logistics

    Logistics and Volume

    Leveraging business‑scale global shipping and third party suppliers to enable reliable supply channels for ASIC.

    Development

    Development

    Working closely with MediaTek's industry‑leading teams to design and develop a new ASIC. Bring together our IP, as well as the customer’s own, to enable the type of best‑in‑class solution that enables the customer's goal. MediaTek has extensive emulation and simulation tools to ensure first silicon success.

    Manufacture Test Assembly Package

    Manufacture, test, assembly, package

    Using our extensive industry partnerships to optimize the process, and if required, test, assemble, and package everything from a microcontroller to a large SoC, MCM, or SiP design, using the latest in 2.5D or 3D packaging technologies.

    Longevity - Support

    Longevity and Support

    From day one, MediaTek works with its clients to understand the lifecycle of a given platform, and works closely with its customers to ensure a complete end‑to‑end support infrastructure for a long as is needed. MediaTek has a long track record of demonstrating successful time‑to‑market delivery while pursuing all client environmental and sustainability targets.

    Low Power Technology

    Low Power Technology

    With our expertise in mobile products, our innate understanding of power efficiency maximizes performance per watt, and performance per dollar, maximizing operational efficiency. MediaTek’s ASIC solutions are designed to be power-efficient, expending energy to perform only the specific workloads, and applications they are programmed for which can reduce power consumption compared to general-purpose processing.

    Longevity and Support

    With a commitment to contributing to global technology standards, our deep partner ecosystem and global sales reach, MediaTek has a long track record of demonstrating successful time-to-market delivery while pursuing all client environmental and sustainability targets. Collaborating with us on a project ensures a long-term commitment and support to ensure your success.

    Please contact MediaTek ASIC design solutions, and let's start a discussion about your custom chip design needs.