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    MediaTek Dimensity
    Flagship 5G Family

    MediaTek Dimensity 7030

    An immensely power efficient chipset that offers best of 5G speeds with brilliant gaming technology that delivers professional grade imaging and videography to advanced AI and latest computing architecture.

    Seamless 5G Experiences

    Seamless 5G sub-6GHz & mmWave Connectivity

    Benefit from a truly seamless 5G experience that fluidly switches between long-reach sub-6GHz and superfast mmWave connections. The Dimensity 7030 can connect to both FR1+FR2 simultaneously, providing up to 53% faster speeds (up to 5.5Gbps) versus competitor platforms that can only connect to 4G LTE and mmWave simultaneously.

    Industry-Leading Dual 5G SIM Technologies

    The Dimensity 7030 continues MediaTek’s dual SIM industry leadership with support for Dual 5G SA with both embedded and physical SIM, giving users more choice of powerful 5G experiences, and the opportunity for VoNR to provide the best quality voice and video call experience from both SIM connections.

    • Dual 5G SA, Dual VoNR
    • DSDS with FR2 support
    • Global DSDS pSIM+eSIM support
    • Google Wireless Fi dual SIM support

    Additional Key Features

    Faster Speeds with 3CC Carrier Aggregation (CA)

    In sub-6GHz exclusive domains, the Dimensity 7030 supports the latest 3CC-CA for faster effective speeds of up to 4.6Gbps, greater reach and handover in a coverage area, and includes validated support for 3CC combinations of US cellular operator bands.

    Faster Sub-6GHz Uplink Speeds

    Support for 2CC-CA uplink in sub-6GHz is ready for US carrier deployment. Using CA uplink improves speeds by up to 67% in urban environments (TDD+FDD) and can double performance in suburban areas (FDD+FDD).

    Exclusive MediaTek FAR mmWave technology

    MediaTek's exclusive Fast, Accurate, Robust (FAR) Beam Technology empowers mmWave (FR2) connections with greater effective performance and connection reliability when moving and where connections are non-line of sight.

    • +47% average throughput gain in non-line of sight with a moving device
    • +21% average throughput gain in non-line of sight from multiple signals
    • +3% average throughput gain in line of sight with a rotating device

    The Dimensity 7030 supports Full HD+ displays with super-fast 144Hz refresh rates. High-speed displays provide notably smoother everyday experiences like scrolling and animations in apps. MediaTek Intelligent Display Sync technology improves the power efficiency by dynamically adjusting the refresh rate to only enable faster speeds when it’s needed most.

    Native 10-bit color gives vibrant HDR experiences from a billion-color palette. Support for the latest global HDR video content standards includes HDR10+ Adaptive, HLG and Dolby Vision.

    The dual HDR video capture engine can record using two cameras simultaneously, giving users unique streaming/videography opportunities to record selfie + environment, or different frames of the same view, such as wide + zoom together, never missing a moment.

    Device makers can build smartphones with a main camera up to 108MP, while also making use of the highly capable MediaTek NPU 550 to apply class-leading AI-noise reduction techniques for superior low-light photos.

    The multi-core MediaTek NPU 550 includes a multi-tasking scheduler that ensures concurrent AI-tasks are efficiently processed with low latency and minimal power consumption. The NPU 550 can natively process standard INT8/16 instructions, as well as FP16 in precision-focused tasks.

    MediaTek HyperEngine 5.0 makes smarter use of CPU and GPU resources, offers exclusive AI-based Variable Rate Shading (AI-VRS), and MediaTek Intelligent Display Sync to collectively improve power efficiency while gaming. Meanwhile, Wi-Fi and 5G optimizations ensure lower-latency network connections to the game server.

    Superfast Wi-Fi 6E (2x2 MIMO) is built right into the chip, giving the Dimensity 7030 superior power efficiency compared to competitor platforms use of external Wi-Fi chip solutions. Using new tri-band connectivity (2.4GHz, 5GHz, 6GHz) gives users faster, lower-latency network connections.

    Using the advanced TSMC N6 (6nm-class) production process means the Dimensity 7030 is exceptionally light on power, extending battery life even for the most demanding smartphone users.

    Specifications

    Processor

    CPU

    • Arm Cortex-A78 @ 2.5GHz
    • Arm Cortex-A55 @ 2.0GHz

    Cores

    Octa (8)

    CPU Bit

    64-bit

    Heterogeneous Multi-Processing

    Yes

    Memory & Storage

    Memory Type

    • LPDDR5
    • LPDDR4x

    Storage Type

    • UFS 3.1
    • UFS 2.1

    Connectivity

    Cellular Technologies

    Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

    Specific Functions

    SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR1 UL 2CC up to 100MHz, FR2 DL 4CC up to 400MHz + MediaTek FAR mmWave technology, FR1+FR2: 100MHz+400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback.

    GNSS

    • GPS L1CA+L5
    • BeiDou B1I+ B2a
    • Glonass L1OF
    • Galileo E1 + E5a
    • QZSS L1CA+ L5
    • NavIC

    Wi-Fi Antenna

    2T2R

    Wi-Fi

    Wi-Fi 6E (a/b/g/n/ac/ax)

    Bluetooth

    5.2

    Display

    Max Display Resolution

    2520 x 1080

    Max Refresh Rate

    144Hz

    AI

    AI Accelerator

    MediaTek NPU 550

    Graphics

    GPU Type

    Arm Mali-G610 MC3

    Video Encoding

    • H.265 / HEVC
    • H.264

    Video Encoding FPS

    4K @ 30FPS

    Video Playback

    • H.265 / HEVC
    • H.264
    • MPEG-1/2/4
    • VP-9

    Video Playback FPS

    4K @ 30FPS

    Camera

    Max Camera ISP

    • 108MP
    • 20MP + 20MP

    Max Video Capture Resolution

    3840 x 2160

    Camera Features

    • Dual HDR video capture hardware
    • 3X HDR-ISP
    • MFNR
    • 3DNR
    • AINR
    • Hardware Depth Engine
    • Warping Engine